evolast® FFKM for Semiconductors

About this product

Brochure with technical information on the evolast® FFKM compounds for the Semiconductor industry

Angst+Pfister: Your trusted partner for high-purity sealing solutions in semiconductor manufacturing – with seamless integration of compounding, engineering, cleanroom production, and distribution. And a 100% European value chain.

A wide choice of components for static and dynamic sealing applications, available in standard and custom dimensions.

From wafer fabrication to advanced etching and deposition processes, evolast® seals deliver maximum reliability under extreme conditions – including high temperatures and exposure to aggressive chemicals and plasma. This makes evolast® the top choice for semiconductor equipment manufacturers and fabs seeking uncompromising performance and contamination control.

evolast® FFKM is 100 % developed, compounded and manufactured in house at the Italian centers of excellence of the Angst+Pfister Group. The complete control of the entire value chain, from formulation, to engineering, to production, allows us to provide customized sealing solutions tailored to each customer’s needs and to ensure the fastest production time with the reassurance of quality and traceability.

• Contact-pressure modelling under extreme conditions • Lifetime prediction with aged-material data • FEA and 3D simulations for first-time-right fit

• Flash-free tool design guided by advanced mold-flow simulation • Full lab & customer testing for chemical, mechanical, and compression-set performance • Virtual molding optimises press parameters and slashes sample-to-series lead time

• Technical expertise and dedicated service in 24 countries across 3 continents • Custom application engineering • Shortest lead times from our stock

In the semiconductor industry, where precision, reliability and contamination control are paramount, evolast® FFKM materials play a crucial role. evolast® FFKM materials are known for their exceptional resistance to extreme temperatures, harsh chemicals and aggressive plasma environments, making them ideal for use in critical semiconductor manufacturing processes. From sealing application in semiconductor equipment to wafer handling, evolast® FFKM materials

offer unmatched performance, ensuring integrity of processes and minimizing downtime due to material failure. Sealing solutions show key qualities such as low plasma erosion rates, high temperature stability, excellent resistance to various chemical processes (dry and wet), and exceptional sealing performance. Additionally, to maintain product purity, all evolast® FFKM seals are compounded, manufactured and packaged in a cleanroom environment.

Wet chemistry is widely used in the processing of wafers, requiring high resistance to specific chemicals, without contributing to organic or metallic contamination of the stripping or cleaning fluids.

Thermal based applications require high-performance materials to give long term sealing resistance at high temperatures, together with specific chemical resistance.

To withstand aggressive plasma conditions, seals need to have high purity, low particle generation and low outgassing to guarantee reliability and long-life.

With outstanding resistance to chemicals, including organic and inorganic acids, alkalis, esters, ethers, ketones, and aldehydes, it excels in harsh wet chemical processes.

Addressing semiconductor contamination concerns, evolast® PS152 features exceptional chemical and temperature resistance, superior mechanical properties, high sealing efficiency, and reduced surface permeation for enhanced material compliance. It works at a maximum service temperature of +275°C. Ultrapure post cleaning and packaging is standard for all evolast® grades.

Source: Angst+Pfister brochure "evolast® FFKM for Semiconductors", https://www.angst-pfister.com/dam/jcr:93e43e08-5c70-40ae-8d30-7a7f6d5f13c6/AP_evolast_FFKM_Semicon_EN_2026.pdf