LGA 3647 1U HEAT SINK
Application; 1U Series Servers; CPU Type; Intel® Xeon® Scalable Processors; Socket Type; LGA 3647; Dimension (LxHxW); 108mm x 78mm x 25.5mm; Material; Al Fins + Heat Pipes; Net Weight; 335 g
About this product
Application 1U Series Servers CPU Type Intel® Xeon® Scalable Processors Socket Type LGA 3647 Dimension (LxHxW) 108mm x 78mm x 25.5mm Material Al Fins + Heat Pipes Net Weight 335 g
1 specification table for this product
Sign in with a free buyer account to see the complete tables, every construction and grade.
No certificates on file for Chenming Electronic Ningbo Co.
Chenming Electronic Ningbo Co
- Location
- China
- US shipments
- 7 to 2 buyers since Jul 22, 2026
Contact the supplier
What are you looking for from Chenming Electronic Ningbo Co?
Prefer a form? Submit an RFQ