EloPin®

About this product

EloPin is a press-fit technology that enables a secure, solder-free connection of components to printed circuit boards. It is pressed directly into the PCB and, thanks to its specific geometry, provides a mechanically stable and highly reliable electrical contact – without thermal stress. NESPER offers comprehensive expertise in the manufacture of EloPin.

With solder-free connection technology, you benefit from higher process reliability, reduced manufacturing costs and a sustainable solution that can be integrated seamlessly into automated production lines.