Press-Fit

About this product

Patented ENNOVI Press-Fit Technology is a solderless interconnect system validated to meet IEC 60352-5 and IPC-9797 standards in high-stress, high-temperature applications. How it works Compliant high normal force technology Whisker mitigation option Applications Addressing the need for high contact reliability and assembly-friendly contacts, our Press-Fit technology offers an alternative to electro-mechanical interconnects, with consistent contact force, reducing the risk of cold joints or poor connections that can occur with soldering. The IEC61709 standard rates Press-Fit with up to 10 times greater reliability. Automotive Ethernet Connector: ENNOVI-Net High-Pin-Count Solutions Multi-Row Board-to-Board Connector: ENNOVI-MB2B Power Busbar PCB Connector: ENNOVI-BusMate Radar Interconnect Battery systems in cars, buses, trucks, subway systems, motorcycles, bicycles, and maritime vessels. Solder strength without solder issues ENNOVI Press-Fit components offer highly repeatable, RoHS-compliant solderless assembly. With unmatched electrical and mechanical characteristics, they avoid quality problems associated with solder, such as cold spots, voids, splatter, and cracks. Performs in high temperatures High normal force interface enables movement to accommodate CTE mismatch, providing excellent performance during high-temperature cycling conditions. Repeatable. Reliable. Press-Fit offers strong, solder-free, repeatable, and highly reliable interfaces with high normal forces. Whisker mitigation We offer IndiCoat™ whisker mitigation electroplating technology as a finishing option for all Press-Fit components. Technical specifications Press-Fit types Off-the-shelf Press-Fit types 1 Sn plated Press-Fit, Imm. Sn PCB of thickness ≥1.6 mm 2 After storage at room temperature for ≥24 hours *ALL SPECIFICATION VALUES INDICATED HEREIN ARE WITHIN TYPICAL VALUE RANGE; ACTUAL SPECIFICATIONS DEPEND ON END APPLICATIONS AND REQUIREMENTS The solder-free alternative Designed for reliability and assembly-friendly contacts, ENNOVI Press-Fit technology provides a high-endurance, highly flexible electro-mechanical interconnect system without the need for solder. Types of Press-Fit technology: Vertical/angled Press-Fit pins for line-to-board connections Dual-ended Press-Fit pins for parallel board-to-board connections Press-Fit with IDC for blade- or wire-to-board connections. ENNOVI-BusMate for high current board-to-board and busbar-to-board connections. SMT Card Edge Contact System for right-angle/perpendicular daughterboard-to-motherboard connections Press-Fit pin Compliant eye-of-the-needle Press-Fit technology with high normal force