CoolShield™ Flex

About this product

Thermal and EMI Shielding Film Product Description CoolShield-Flex is a stack-up film of thermal gap filler, metal foils and conductive pressure sensitive adhesives (CPSA). Used together with board level shielding (BLS) frame, it can perform both thermal transmission and shielding for ICs in electronics devices. Meanwhile, CoolShield-Flex provides lower total thickness comparing with other solutions, which makes it fit for use in all compact space designs such as smartphones, tablets and other consumer electronics. Features and Benefits • Low height • Low weight • Efficient thermal path • Good shielding effectiveness • Ease of assembly with thermal interface material applied both sides • Can survive reflow • flexible film allows for PCB component height tolerance during assembly Industries: 5G Data Infrastructure · 5G Handset · 5G Peripherals · 5G Telecom · Aerospace · Blade servers · Cabinet Applications · Cloud · Commercial Telecom · Computing · Consumer · Consumer Accessories · Consumer Electronics · Data Infrastructure · Datacom · Gaming · General applications · Handset · Healthcare · Healthcare / Medical · IT · Medical · Medical Equipment · Military · Mobile Devices · Mobile Infrastructure · Network and telecommunications equipment · Networking · Personal Medical Devices · Robotics · Satellite · Security and defense · Servers · Small consumer electronics · Tablets · Telecom · Telecom, 5G, Consumer, Automotive, Military · Telecom, Automotive, Other · Telecom, consumer and general applications · Telecommunications · Video graphics · Wearable electronics · Wireless Applications: EMI Shielding · Low Height Shielding · Thermal Transfer Technical Specification