CoolZorb™ 200

About this product

Hybrid Thermal/EMI Absorber Product Description CoolZorb 200 is a hybrid absorber/thermal management material that is used for EMI mitigation and heat dissipation. It is used like a traditional thermal gap filler between a heat source such as an IC and a heat sink or other heat transfer device or metal chassis. CoolZorb 200 also functions to suppress unwanted energy coupling, resonances or surface currents causing board level EMI issues. Features and Benefits • Cost effective hybrid material for thermal and EMI Absorbing functionality • Good EMI suppression within 1-25GHz • Inherent surface tack typical of standard thermal gap fillers • Tested to meets UL 94 V0 flame requirements • Dual functional properties of thermal conductivity and EMI reduction provide two in one solution for easier design and assembly and lower cost of ownership • Improved reliability performance of electronics • Better signal integrity due to reduction of EMI • Consistent performance of electronics due to temperature stability and low outgassing properties of product • Improved EMC performance and resultant lower cost to meet compliance requirements • Environmentally friendly solution that meets regulatory requirements including RoHS and REACH Industries: 5G Data Infrastructure · 5G Handset · 5G Peripherals · 5G Telecom · Aerospace · Automotive · Automotive and Industrial Electronics · Autonomous Vehicle · Blade servers · Cabinet Applications · Cloud · Commercial Telecom · Computing · Consumer · Consumer Accessories · Consumer Electronics · Data Infrastructure · Datacom · Electric Vehicle · Gaming · Handset · Medical · Medical Equipment · Military · Mobile Devices · Mobile Infrastructure · Network and telecommunications equipment · Networking · Personal Medical Devices · Printers · Robotics · Satellite · Security and defense · Servers · Small consumer electronics · Telecom · Telecom, 5G, Consumer, Automotive, Military · Telecom, Automotive, Other · Telecom, consumer and general applications · Telecommunications · Transportation · Video graphics · Wearable electronics · Wireless Applications: EMI Attenuation · mmWave · Optical Module · Thermal Transfer Technical Specification