HeatsinX™

About this product

Heatsink/EMI Shielding/Thermal Gap Filler System Product Description HeatsinX solution provides a die-cast, deep drawn, or stamped heatsink that has been enhanced for its design needs with a combination of thermal interface material, CoolZorb, Form-in-Place EMI gaskets, RF absorbers, or EMI shielding solutions. With unique automation technology developed by Laird Performance, we can ensure a cost-effective assembly, leading to a simplified sourcing structure and lower total cost of ownership for out customers. Features and Benefits • Heatsink combined with Thermal Interface Material (TIM) / EMI Shielding / EMI Absorbing • Wide option of thermal products (automated TIM pick and place or dispensable TIM) • Wide option of Form-in-Place conductive gaskets • Automated application of Fabric over Foam conductive gaskets or conductive foam • Combination with CoolZorb line of products for high frequency application • Simulation support for complex design • Inhouse automation technology Industries: 5G Data Infrastructure · 5G Handset · 5G Peripherals · 5G Telecom · Aerospace · Automotive · Automotive and Industrial Electronics · Autonomous Vehicle · Blade servers · Cloud · Commercial Telecom · Computing · Consumer · Consumer Accessories · Consumer Electronics · Data Infrastructure · Datacom · Electric Vehicle · Energy & Utilities · Gaming · Healthcare · Healthcare / Medical · Industrial · Industrial Electronics · Industrial Markets · Industrial/Production · Medical · Medical Equipment · Military · Mobile Devices · Mobile Infrastructure · Network and telecommunications equipment · Networking · Personal Medical Devices · Printers · Satellite · Security and defense · Servers · Small consumer electronics · Tablets · Telecom · Telecom, 5G, Consumer, Automotive, Military · Telecom, Automotive, Other · Telecom, consumer and general applications · Telecommunications · Transportation · Video graphics · Wireless Applications: EMI Attenuation · EMI Shielding · Environmental Protection · mmWave · Optical Module · Thermal Transfer Technical Specification