One-Piece Board Level Shields with Spring Fingers

About this product

One-Piece Board Level Shields Product Description BMI-S-608 is a one-part shielding solution with current applications in the automotive sector. No top-mount cover is applied to its four-sided shield frame designed to surround heat-sensitive components. Instead, the diecast/heat sink main housing is placed directly inside the shield frame and is clasped tightly by the integrated contact spring fingers. BMI-S-608 provides cost-effective EMI shielding of components while its spring fingers create electrical contact and grounding of the diecast/heat sink. The snug fit and secure sealing of the diecast housing ensures it will retain direct, surface-to-surface contact with high thermal load integrated circuits. View Case Study Features and Benefits • Enhanced design freedom involving PCB layout • Permits reduction in spacing between adjacent shields • Enables easier repairs of components • Rigid Corner • No tooling costs with standard off-the-shelf designs • Alternative to multi-component manufacturer solutions • Base materials: Stainless steel X10 CrNi18-8, (EN 1.4310) • Surface plating/finish: Pre-plated matte tin plating: 2-5 μm • Underlayer nickel: Minimum 1 μm • Superior solderability and corrosion performance • Version-Dimensions: Surface mount device frame 39,6mm 39,6mm 7mm • Operating temperature: -40°C up to +125°C, Short-term +150°C • Material thickness: 0.2mm • Flatness/Coplanarity: Typically, <0.10mm Industries: 5G Telecom · 6G Telecom · Aerospace/Defense · Automotive and Industrial Electronics · Consumer Electronics · Electric Vehicle · Healthcare / Medical · Industrial Electronics · Medical · Military · Telecom, 5G, Consumer, Automotive, Military · Test and Measure Applications: Automotive ADAS · Automotive Electronics · Automotive Infotainment · EMI Shielding · PCB Component Level Shielding Technical Specification