Tflex™ 300

About this product

Silicone based Thermal Gap Filler Product Description Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures. Tflex 300-H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis. Features and Benefits • Extreme compliancy allows material to “totally blanket” component(s) • Low compression set enables the pad to be reused many times Industries: Aerospace/Defense · Automotive · Consumer · Industrial · Telecom/Datacom Applications: Automotive ADAS · Automotive Electronics · Automotive Infotainment · Automotive Powertrain/ECUs · Drones/Satellites · Gaming Systems · Instrumentation · Notebooks/Tablets/Portable Devices · Routers · Smart Home Devices · Wireless infrastructure Technical Specification