Tflex™ 300TG

About this product

Silicone based Thermal Gap Filler Product Description The high rate of compliancy of Tflex 300TG allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex 300TG, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistance can be achieved at low pressures. A Tgard silicone liner has been added to the Tflex 300TG to offer a guaranteed dielectric barrier. The Tgard is cut-through resistant and provides easier part handling in mass production. Features and Benefits • Extreme compliancy allows material to “totally blanket” component(s) • Low compression set enables the pad to be reused many times • Provides a dielectric barrier Industries: Aerospace/Defense · Automotive · Consumer · Industrial · Telecom/Datacom Applications: Automotive ADAS · Automotive Electronics · Automotive Infotainment · Automotive Powertrain/ECUs · Drones/Satellites · Gaming Systems · Instrumentation · Notebooks/Tablets/Portable Devices · Routers · Smart Home Devices · Wireless infrastructure Technical Specification