Tflex™ HD7.5

About this product

Silicone based Thermal Gap Filler Product Description Laird’s Tflex™ HD7.5 gap filler is a new developed very soft silicone material in our high deflection series. With a thermal conductivity of 7.5W/ mk, Tflex™ HD7.5 is designed to provide superior pressure versus deflection characteristics. The material will provide minimal stress on components during application while maintaining low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device. Features and Benefits • · 7.5 W/mK thermal conductivity soft pad • · Low pressure versus deflection • · Minimizes board and component stress • · Low outgassing and oil bleeding Technical Specification