Tflex™ HD700

About this product

Silicone based Thermal Gap Filler Product Description Tflex™ HD700 thermal gap filler combines 5 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device. Tflex™ HD700PI can be provided with an integrated polyimide film on one side. This liner provides numerous application benefits like electrical isolation, placement ease during assembly, and tear resistance for applications that require shear. Tflex™ HD700 and Tflex™ HD700PI are available in thickness from 0.5mm (0.020”) to 5mm (0.200”). The standard material Tflex™ HD700 material is a light pink color, but we do have the option to provide this in a grey color if a neutral color is desired (Tflex HD700,GR). Features and Benefits • Low pressure versus deflection • Excellent surface wetting for low contact resistance • Minimizes board and component stress • Large tolerance applications • Environmentally friendly solution that meets regulatory requirements including RoHS and REACH Industries: Aerospace/Defense · Automotive · Consumer · Industrial · Telecom/Datacom Applications: Automotive ADAS · Automotive Electronics · Automotive Infotainment · Automotive Powertrain/ECUs · Drones/Satellites · Gaming Systems · Instrumentation · Notebooks/Tablets/Portable Devices · Routers · Smart Home Devices · Wireless infrastructure Technical Specification