Tflex™ HP34

About this product

High Performance Gap Filler Product Description Tflex™ HP34 is an exceptional gap filler product with a thermal conductivity of 34 W/mK. Tflex HP34 is a non silicone based formulation containing aligned graphite materials. Compared to typical graphite-based materials, Tflex HP34 is considerably softer with excellent deflection properties. Features and Benefits • 34 W/mK bulk thermal conductivity • Non-silicone based formulation • Maintains thermal performance under increased pressure • Low contact resistance with mating surfaces • Environmentally friendly solution that meets RoHS and REACH Industries: 5G Data Infrastructure · 5G Telecom · Data Infrastructure · Aerospace/Defense · Automotive · Datacom · Consumer Electronics · Servers Applications: 5G Antenna Radome · Wireless infrastructure · Routers · Servers · Instrumentation/Test and measure · Notebooks/Tablets/Portable Devices · Smart Home Devices · Telecom cabinets Technical Specification