Tflex™ HR6.5

About this product

Product Description Laird’s Tflex™ HR6.5 gap filler is a thermal interface material with a thermal conductivity of 6 W/m-K and high recovery properties. This product is designed to withstand cyclic gap changes due to vibration, shock, or warpage, maintaining consistent thermal performance over the life of the part. It also exhibits rebound properties after pressure is removed. Tflex™ HR6.5 material will provide minimal stress on components and is easily assembled. In many cases it can be reused after rework due to its good rebound capability. Features and Benefits • · >6.0 W/mK thermal conductivity • · High resiliency and good recovery • · Low peak and residual force • · Low outgassing and oil bleeding • · Good elongation Industries: Cloud · Computing · Datacom · Telecom, 5G, Consumer, Automotive, Military Applications: Base station/Power amplifier/Acitve antenna unit /small cell · Automotive Infotainment · Automotive Electronics · Instrumentation/Test and measure · Computer servers · Notebooks/Tablets/Portable Devices Technical Specification