Tflex™ SF10

About this product

Non-silicone Based Formulation Thermal Gap Filler Product Description Tflex SF10 is an innovative high performing thermal material in Laird’s gap filler portfolio. The non-silicone based formulation material measures 10 W/mk and has excellent deflection properties which provides minimal pressure on components. Very little pressure is required to reach the lowest possible thermal resistance. Features and Benefits • Non-silicone based formulation • Low Shore Hardness • Low pressure versus deflection • Minimizes board and component stress • No fiberglass reinforcement • Environmentally friendly solution that meets regulatory requirements including RoHS and REACH Industries: Automotive · Consumer · Industrial · Telecom/Datacom · Aerospace/Defense Applications: Automotive Electronics · Automotive ADAS · Automotive Powertrain/ECUs · Automotive Infotainment · Routers · Hard Disk Drives · Solid State Drives · Wireless infrastructure · Drones/Satellites · Gaming Systems · Smart Home Devices · Notebooks/Tablets/Portable Devices Technical Specification