Tflex™ SF4

About this product

Non-Silicone Based Thermal Gap Filler Product Description Tflex SF4 is an innovative, high performing thermal material in Laird's non-silicone based formulation gap filler portfolio. The non-silicone based formulation provides products with excellent deflection properties, providing minimal pressure on components during deflection. Very little pressure is required to reach the lowest possible thermal resistance. Thickness ranges from 0.5mm (0.020") to 4mm (0.160") in 0.5mm (0.020") increments available as standard. Features and Benefits • Non-silicone Based Formulation • Low Peak and Residual Pressure • Excellent surface wetting for low contact resistance • Low Thermal Resistance • UL V0 Flammability Rating • Environmentally friendly solution that meets regulatory requirements including RoHS and REACH Industries: Aerospace/Defense · Automotive · Consumer Electronics · Datacom · Industrial Electronics · Telecom Applications: Automotive ADAS · Graphic Cards · Instrumentation · Optical Module · Routers · Servers Technical Specification