Tflex™ SF600

About this product

Non-silicone Based Formulation Thermal Gap Filler Product Description Compliant non-silicone based formulation 3.0 W/mK thermally conductive Gap Filler Tflex SF600 is a high performance non-silicone based formulation thermal gap filler with a conductivity of 3.0 W/mK. Tflex SF600 is designed for applications which are silicone sensitive. RoHS compliant. Standard Thickness: Standard thickness is 0.010-inch (0.25 mm) through 0.140-inch (3.56 mm) and available in 0.010-inch (0.25 mm) increments. 0.010-inch is only available in custom cut parts (sheet material is not available). Material Name and Thickness: Tflex indicates Laird Technologies™ brand thermally conductive elastomeric gap filler product. SF6xx indicates ˜SF600 series™ 3.0 W/mK material and xxx indicates thickness in mils (0.001-inches) Examples: Tflex SF620 = 0.020-inch thick material Features and Benefits • Non-silicone based formulation • Low Dielectric Constant • Differential tack option available for easy assembly and rework • Minimal compression set • Environmentally friendly solution that meets regulatory requirements including RoHS and REACH Industries: Aerospace/Defense · Automotive · Consumer · Industrial · Telecom/Datacom Applications: Automotive ADAS · Automotive Electronics · Automotive Infotainment · Automotive Powertrain/ECUs · Drones/Satellites · Gaming Systems · Instrumentation · Notebooks/Tablets/Portable Devices · Routers · Smart Home Devices · Solid State Drives · Wireless infrastructure Technical Specification