Tflex™ SF800

About this product

Non-silicone Based Formulation Thermal Gap Filler Product Description Tflex SF800 is a high-performance, compliant, non-silicone based formulation thermal interface material. By coupling extremely high thermal conductivity with exceptional wetting characteristics, Tflex SF800 provides some of the lowest thermal resistance values in the industry. This makes it well-suited for applications where silicone based pads are traditionally used as well as those applications which are silicone sensitive. Tflex SF800 is naturally tacky on both sides requiring no additional adhesive coating, which would inhibit thermal performance. The natural tack allows for the pad to be held in place during assembly. Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. Features and Benefits • Non-silicone based formulation gap filler • Exceptionally low thermal resistance • Environmentally friendly solution that meets regulatory requirements including RoHS and REACH Industries: Aerospace/Defense · Automotive · Consumer · Industrial · Telecom/Datacom Applications: Automotive ADAS · Automotive Electronics · Automotive Infotainment · Automotive Powertrain/ECUs · Drones/Satellites · Gaming Systems · Instrumentation · Notebooks/Tablets/Portable Devices · Routers · Smart Home Devices · Solid State Drives · Wireless infrastructure Technical Specification