Tpcm™ 580

About this product

Thermal Phase Change Material Product Description Tpcm™ 580 is a high-performance thermal phase change material designed to meet the thermal reliability and price requirements of high-end thermal applications. Tpcm 580 is inherently tacky, flexible and exceptionally easy-to-use. At temperatures above its transition temperature of 50 C (122 F), the Tpcm 580 begins to soften and flow, filling the microscopic irregularities of the components. The result is an interface with minimal thermal contact resistance. Due to the gradual change in viscosity (softening), it minimizes migration (pump-out). The Tpcm 580 can be supplied as cut parts in strips and rolls with top tabbed liners for easy application. The top tabbed liner can be removed immediately or provide a protective cover during shipping, and can be removed at assembly. It can also be supplied in sheets and custom die-cut configurations; and meets all environmental requirements including RoHS. Features and Benefits • Low total thermal resistance • Inherently tacky and easy to use, no adhesive required • High thermal reliability Industries: Consumer · Telecom/Datacom Applications: Graphic Cards · Hard Disk Drives · IGBTs · Memory Modules · Notebooks/Tablets/Portable Devices · Servers · Smart Home Devices · Wireless infrastructure Technical Specification